Coyle, R; Reid, M; Osenbach, J; Ryan, C; Read, P; Fleming, D; Popowich, R; McCormick, H; Punch, J; Collins, M; Koshmeider, T; Manock, J; Kummerl, S; Chatterji, I

2009

October

Journal Of Electronic Materials

A Phenomenological Study of the Effect of Microstructural Evolution on Pb-free Solder Joint Fatigue Resistance

Published

()

Accepted for publication in a special edition