Coyle R., Reid M., Ryan C., Popowich R., Read P., Fleming D., Collins M., Punch J., Chatterji I.

IEEE Electronic Components and Technology Conference

The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor

2009

Published

1

()

423

430

10.1109/ECTC.2009.5074048